Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant with Exemption |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 8 |
Part Status | LTB |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single Quad Drain Triple Source |
Package Width | 3.99(Max) |
Package Height | 1.57(Max) |
Package Length | 4.98(Max) |
Product Category | Power MOSFET |
Supplier Package | SOIC N |
Process Technology | HEXFET |
Standard Package Name | SOP |
Typical Fall Time (ns) | 66 |
Typical Rise Time (ns) | 57 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 2500 |
Typical Gate Charge @ 10V (nC) | 35 |
Typical Gate Charge @ Vgs (nC) | 35@10V|18@4.5V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 19 |
Maximum Drain Source Voltage (V) | 30 |
Typical Turn-Off Delay Time (ns) | 80 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 12 |
Typical Input Capacitance @ Vds (pF) | 1680@25V |
Maximum Drain Source Resistance (mOhm) | 11.9@10V |
Description |