Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Not Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Pin Count | 18 |
Automotive | No |
PCB changed | 18 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single Hex Drain Dual Gate Octal Source |
Package Width | 7.49(Max) |
Package Height | 2.92(Max) |
Package Length | 9.14(Max) |
Product Category | Power MOSFET |
Supplier Package | LCC |
Process Technology | HEXFET |
Standard Package Name | LCC |
Typical Fall Time (ns) | 45(Max) |
Typical Rise Time (ns) | 70(Max) |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 14000 |
Typical Gate Charge @ 10V (nC) | 26(Max) |
Typical Gate Charge @ Vgs (nC) | 26(Max)@10V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Output Capacitance (pF) | 340 |
Typical Turn-On Delay Time (ns) | 14(Max) |
Maximum Drain Source Voltage (V) | 60 |
Typical Turn-Off Delay Time (ns) | 37(Max) |
Typical Gate to Drain Charge (nC) | 13(Max) |
Maximum Gate Threshold Voltage (V) | 4 |
Typical Gate to Source Charge (nC) | 5(Max) |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 6.7 |
Typical Input Capacitance @ Vds (pF) | 640@25V |
Typical Reverse Recovery Charge (nC) | 1900(Max) |
Maximum Drain Source Resistance (mOhm) | 170@10V |
Description |