Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant with Exemption |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
PCB changed | 8 |
Part Status | NRND |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Dual |
Package Width | 6 |
Package Height | 0.88 |
Package Length | 5 |
Product Category | Power MOSFET |
Supplier Package | PQFN EP |
Maximum IDSS (uA) | 1 |
Process Technology | HEXFET |
Standard Package Name | QFN |
Typical Fall Time (ns) | 15@Q 1|65@Q 2 |
Typical Rise Time (ns) | 61@Q 1|98@Q 2 |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 31000@Q 1|50000@Q 2 |
Typical Gate Charge @ Vgs (nC) | 10@4.5V@Q 1|31@4.5V@Q 2 |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 10@Q 1|16@Q 2 |
Maximum Drain Source Voltage (V) | 25 |
Typical Turn-Off Delay Time (ns) | 13@Q 1|26@Q 2 |
Typical Gate to Drain Charge (nC) | 12 |
Maximum Gate Threshold Voltage (V) | 2.1 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 64@Q 1|145@Q 2 |
Typical Input Capacitance @ Vds (pF) | 1314@13V@Q 1|3756@13V@Q 2 |
Maximum Drain Source Resistance (mOhm) | 3.2@10V@Q 1|1.1@10V@Q 2 |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |