Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 18 |
Automotive | No |
Lead Shape | No Lead |
PCB changed | 18 |
Part Status | LTB |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Dual |
Package Width | 5 |
Package Height | 0.95(Max) |
Package Length | 6 |
Product Category | Power MOSFET |
Supplier Package | PQFN EP |
Process Technology | HEXFET |
Standard Package Name | QFN |
Typical Fall Time (ns) | 5.9@Q 1|14@Q 2 |
Typical Rise Time (ns) | 15@Q 1|35@Q 2 |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 2400@Q 1|3400@Q 2 |
Typical Gate Charge @ Vgs (nC) | 8.3@4.5V@Q 1|34@4.5V@Q 2 |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 12@Q 1|22@Q 2 |
Maximum Drain Source Voltage (V) | 30 |
Typical Turn-Off Delay Time (ns) | 12@Q 1|28@Q 2 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 28@Q 2|13@Q 1 |
Typical Input Capacitance @ Vds (pF) | 1060@15V@Q 1|4450@15V@Q 2 |
Maximum Drain Source Resistance (MOhm) | 8.6@10V@Q 1|3@10V@Q 2 |
Description |