Product Attribute | Attribute Value |
HTS | 8541.21.00.95 |
PPAP | No |
EU RoHS | Not Compliant |
Mounting | Surface Mount |
ECCN (US) | Contact Export |
Pin Count | 4 |
Automotive | No |
Lead Shape | No Lead |
PCB changed | 4 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single |
Package Width | 2.74(Max) |
Package Height | 1.42(Max) |
Package Length | 3.25(Max) |
Product Category | Power MOSFET |
Supplier Package | UB |
Process Technology | CMOS |
Standard Package Name | SMD |
Typical Fall Time (ns) | 27(Max) |
Typical Rise Time (ns) | 22(Max) |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 570 |
Typical Gate Charge @ Vgs (nC) | 3.6(Max)@4.5V |
Maximum Gate Source Voltage (V) | ±10 |
Typical Turn-On Delay Time (ns) | 22(Max) |
Maximum Drain Source Voltage (V) | 60 |
Typical Turn-Off Delay Time (ns) | 27(Max) |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 0.53 |
Typical Input Capacitance @ Vds (pF) | 167@25V |
Maximum Drain Source Resistance (MOhm) | 1400@4.5V |
Description |