Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Not Compliant |
Material | Si |
Mounting | Surface Mount |
Pin Count | 3 |
Automotive | No |
Lead Shape | No Lead |
PCB changed | 3 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single |
Package Width | 10.28(Max) |
Package Height | 2.61(Max) |
Package Length | 7.64(Max) |
Supplier Package | SMD-0.5 |
Process Technology | HEXFET |
Standard Package Name | SMD |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 750000 |
Maximum Drain Source Voltage (V) | 30 |
Maximum Continuous Drain Current (A) | 22 |
Maximum Drain Source Resistance (MOhm) | 14@10V |
Description |