Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 6 |
Automotive | No |
Lead Shape | No Lead |
PCB changed | 6 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Dual |
Package Width | 2 |
Package Height | 0.88 |
Package Length | 2 |
Product Category | Power MOSFET |
Supplier Package | PQFN EP |
Maximum IDSS (uA) | 1 |
Process Technology | HEXFET |
Standard Package Name | QFN |
Typical Fall Time (ns) | 9.4 |
Typical Rise Time (ns) | 11 |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 1500 |
Typical Gate Charge @ Vgs (nC) | 2.8@4.5V |
Maximum Gate Source Voltage (V) | ±12 |
Typical Turn-On Delay Time (ns) | 4.4 |
Maximum Drain Source Voltage (V) | 30 |
Typical Turn-Off Delay Time (ns) | 11 |
Maximum Gate Threshold Voltage (V) | 1.1 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 3.6 |
Typical Input Capacitance @ Vds (pF) | 270@25V |
Maximum Drain Source Resistance (MOhm) | 63@4.5V |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |