Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 3 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 3 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single |
Package Width | 1.4(Max) |
Package Height | 1.02(Max) |
Package Length | 3.04(Max) |
Product Category | Power MOSFET |
Supplier Package | SOT-23 |
Process Technology | HEXFET |
Standard Package Name | SOT-23 |
Typical Fall Time (ns) | 16 |
Typical Rise Time (ns) | 7.7 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 1300 |
Typical Gate Charge @ Vgs (nC) | 2.9@4.5V |
Maximum Gate Source Voltage (V) | ±12 |
Typical Turn-On Delay Time (ns) | 5.3 |
Maximum Drain Source Voltage (V) | 20 |
Typical Turn-Off Delay Time (ns) | 26 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 2.6 |
Typical Input Capacitance @ Vds (pF) | 220@16V |
Maximum Drain Source Resistance (mOhm) | 135@4.5V |
Description |