PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 3 |
Automotive | No |
PCB changed | 3 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single |
Package Width | 0.85 |
Package Height | 0.7 |
Package Length | 1.6 |
Product Category | Small Signal |
Supplier Package | SC-89 |
Maximum IDSS (uA) | 100 |
Standard Package Name | SC |
Typical Fall Time (ns) | 7.6 |
Typical Rise Time (ns) | 4.4 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 300 |
Typical Gate Charge @ Vgs (nC) | 1.82@4.5V |
Maximum Gate Source Voltage (V) | ±6 |
Typical Output Capacitance (pF) | 16 |
Typical Turn-On Delay Time (ns) | 3.7 |
Maximum Drain Source Voltage (V) | 20 |
Typical Gate Plateau Voltage (V) | 1.35 |
Typical Turn-Off Delay Time (ns) | 25 |
Maximum Diode Forward Voltage (V) | 1.1 |
Typical Diode Forward Voltage (V) | 0.67 |
Typical Gate to Drain Charge (nC) | 0.42 |
Maximum Gate Threshold Voltage (V) | 1.1 |
Minimum Gate Threshold Voltage (V) | 0.45 |
Typical Gate Threshold Voltage (V) | 0.76 |
Typical Gate to Source Charge (nC) | 0.3 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 0.915 |
Operating Junction Temperature (°C) | -55 to 150 |
Typical Input Capacitance @ Vds (pF) | 110@16V |
Maximum Drain Source Resistance (MOhm) | 230@4.5V |
Maximum Gate Source Leakage Current (nA) | 1000 |
Maximum Positive Gate Source Voltage (V) | 6 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 1.3 |
Maximum Power Dissipation on PCB @ TC=25°C (W) | 0.3 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 12@16V |
Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 0.915 |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 400 |
Description | |