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MOSFETs NVD6824NLT4G-VF01
onsemi
NVD6824NLT4G-VF01
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
| Product Attribute | Attribute Value |
| Tab | Tab |
| PPAP | Yes |
| SVHC | Yes |
| EU RoHS | Compliant with Exemption |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 3 |
| Automotive | Yes |
| Lead Shape | Gull-wing |
| PCB changed | 2 |
| Part Status | Active |
| Channel Mode | Enhancement |
| Channel Type | N |
| Configuration | Single |
| Package Width | 6.22(Max) |
| Package Height | 2.38(Max) |
| Package Length | 6.73(Max) |
| Product Category | Power MOSFET |
| Supplier Package | DPAK |
| Maximum IDSS (uA) | 1 |
| Standard Package Name | TO-252 |
| SVHC Exceeds Threshold | Yes |
| Typical Fall Time (ns) | 42 |
| Typical Rise Time (ns) | 55 |
| Number of Elements per Chip | 1 |
| Maximum Power Dissipation (mW) | 3900 |
| Typical Gate Charge @ 10V (nC) | 66 |
| Typical Gate Charge @ Vgs (nC) | 66@10V|34@4.5V |
| Maximum Gate Source Voltage (V) | ±20 |
| Typical Output Capacitance (pF) | 187 |
| Typical Turn-On Delay Time (ns) | 15 |
| Maximum Drain Source Voltage (V) | 100 |
| Typical Gate Plateau Voltage (V) | 3.2 |
| Typical Turn-Off Delay Time (ns) | 31 |
| Maximum Diode Forward Voltage (V) | 1.2 |
| Typical Diode Forward Voltage (V) | 0.84 |
| Typical Gate to Drain Charge (nC) | 18 |
| Maximum Gate Threshold Voltage (V) | 2.5 |
| Minimum Gate Threshold Voltage (V) | 1.5 |
| Typical Gate to Source Charge (nC) | 9 |
| Typical Reverse Recovery Time (ns) | 38 |
| Maximum Operating Temperature (°C) | 175 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Continuous Drain Current (A) | 8.5 |
| Operating Junction Temperature (°C) | -55 to 175 |
| Typical Input Capacitance @ Vds (pF) | 3468@25V |
| Typical Reverse Recovery Charge (nC) | 59 |
| Maximum Drain Source Resistance (mOhm) | 20@10V |
| Maximum Gate Source Leakage Current (nA) | 100 |
| Maximum Positive Gate Source Voltage (V) | 20 |
| Maximum Pulsed Drain Current @ TC=25°C (A) | 238 |
| Maximum Power Dissipation on PCB @ TC=25°C (W) | 3.9 |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 133@25V |
| Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 8.5 |
| Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 39 |
| Description |
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