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NX3008NBKSH
NX3008NBKSH
MOSFETs NX3008NBKSH
Nexperia
NX3008NBKSH
--
Diodes, Transistors and Thyristors
MOSFETs
NX3008NBKSH.pdf
Specification
Product AttributeAttribute Value
HTS8541.21.00.95
PPAPUnknown
SVHCYes
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count6
AutomotiveYes
PCB changed6
Part StatusActive
Channel ModeEnhancement
Channel TypeN
ConfigurationDual
Package Width1.35(Max)
Package Height1(Max)
Package Length2.2(Max)
Product CategorySmall Signal
Supplier PackageTSSOP
Maximum IDSS (uA)1
Process TechnologyTMOS
Typical Fall Time (ns)19
Typical Rise Time (ns)11
Supplier Temperature GradeAutomotive
Number of Elements per Chip2
Maximum Power Dissipation (mW)445
Typical Gate Charge @ Vgs (nC)0.52@4.5V
Maximum Gate Source Voltage (V)8
Typical Output Capacitance (pF)6.5
Typical Turn-On Delay Time (ns)15
Maximum Drain Source Voltage (V)30
Typical Gate Plateau Voltage (V)2.15
Typical Turn-Off Delay Time (ns)69
Maximum Diode Forward Voltage (V)1.2
Typical Diode Forward Voltage (V)0.85
Typical Gate to Drain Charge (nC)0.08
Maximum Gate Threshold Voltage (V)1.1
Minimum Gate Threshold Voltage (V)0.6
Typical Gate Threshold Voltage (V)0.9
Typical Gate to Source Charge (nC)0.17
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)0.35
Operating Junction Temperature (°C)-55 to 150
Typical Input Capacitance @ Vds (pF)34@15V
Maximum Drain Source Resistance (MOhm)1400@4.5V
Maximum Gate Source Leakage Current (nA)1000
Maximum Positive Gate Source Voltage (V)8
Maximum Pulsed Drain Current @ TC=25°C (A)1.4
Maximum Power Dissipation on PCB @ TC=25°C (W)0.32
Typical Reverse Transfer Capacitance @ Vds (pF)2.2@15V
Maximum Continuous Drain Current on PCB @ TC=25°C (A)0.35
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)445
Description
Trans MOSFET N-CH 30V 0.35A Automotive 6-Pin TSSOP T/R
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