Product Attribute | Attribute Value |
Tab | Tab |
PPAP | No |
EU RoHS | Supplier Unconfirmed |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Pin Count | 5 |
Automotive | No |
PCB changed | 4 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single Triple Source |
Package Width | 4.1(Max) |
Package Height | 1.1(Max) |
Package Length | 5(Max) |
Product Category | Power MOSFET |
Supplier Package | LFPAK |
Maximum IDSS (uA) | 1 |
Process Technology | NextPower |
Typical Fall Time (ns) | 3.1 |
Typical Rise Time (ns) | 3.8 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 25000 |
Typical Gate Charge @ 10V (nC) | 8.4|8 |
Typical Gate Charge @ Vgs (nC) | 8.4@10V|8@10V|4.3@4.5V |
Maximum Gate Source Voltage (V) | 20 |
Typical Turn-On Delay Time (ns) | 6.2 |
Maximum Drain Source Voltage (V) | 40 |
Typical Turn-Off Delay Time (ns) | 9.9 |
Maximum Gate Threshold Voltage (V) | 1.95 |
Maximum Operating Temperature (°C) | 175 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 24 |
Typical Input Capacitance @ Vds (pF) | 520@20V |
Maximum Drain Source Resistance (MOhm) | 23@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |