Product Attribute | Attribute Value |
EU RoHS | Compliant with Exemption |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
PCB changed | 8 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Dual |
Package Width | 4.7(Max) |
Package Height | 1.05(Max) |
Package Length | 5.3(Max) |
Product Category | Power MOSFET |
Supplier Package | LFPAK-D |
Process Technology | NextPowerS3 |
Typical Fall Time (ns) | 11.8 |
Typical Rise Time (ns) | 9 |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 85000 |
Typical Gate Charge @ 10V (nC) | 26 |
Typical Gate Charge @ Vgs (nC) | 26@10V |
Maximum Gate Source Voltage (V) | 20 |
Typical Turn-On Delay Time (ns) | 7 |
Maximum Drain Source Voltage (V) | 40 |
Typical Turn-Off Delay Time (ns) | 19 |
Maximum Operating Temperature (°C) | 175 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 98 |
Operating Junction Temperature (°C) | -55 to 175 |
Typical Input Capacitance @ Vds (pF) | 1850@25V |
Maximum Drain Source Resistance (mOhm) | 4.2@10V |
Description |