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PSMNR58-30YLHX
PSMNR58-30YLHX
MOSFETs PSMNR58-30YLHX
Nexperia
PSMNR58-30YLHX
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Diodes, Transistors and Thyristors
MOSFETs
Specification
Product AttributeAttribute Value
TabTab
PPAPNo
EU RoHSCompliant with Exemption
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count5
AutomotiveNo
PCB changed4
Part StatusActive
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle Triple Source
Package Width4.7(Max)
Package Height1.1(Max)
Package Length5.3(Max)
Product CategoryPower MOSFET
Supplier PackageLFPAK
Maximum IDSS (uA)1
Process TechnologyNextPowerS3
Standard Package NameFPAK
Typical Fall Time (ns)50
Typical Rise Time (ns)62
Number of Elements per Chip1
Maximum Gate Resistance (Ohm)3.9
Minimum Gate Resistance (Ohm)0.6
Maximum Power Dissipation (mW)333000
Typical Gate Charge @ 10V (nC)114
Typical Gate Charge @ Vgs (nC)55@4.5V|114@10V
Maximum Gate Source Voltage (V)20
Typical Output Capacitance (pF)3621
Typical Turn-On Delay Time (ns)37
Maximum Drain Source Voltage (V)30
Typical Gate Plateau Voltage (V)2.5
Typical Turn-Off Delay Time (ns)65
Maximum Diode Forward Voltage (V)1
Typical Diode Forward Voltage (V)0.75
Typical Gate to Drain Charge (nC)19
Maximum Gate Threshold Voltage (V)2.2
Minimum Gate Threshold Voltage (V)1.2
Typical Gate Threshold Voltage (V)1.62
Typical Gate to Source Charge (nC)15
Typical Reverse Recovery Time (ns)50
Maximum Operating Temperature (°C)175
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)380
Operating Junction Temperature (°C)-55 to 175
Typical Input Capacitance @ Vds (pF)6912@15V
Typical Reverse Recovery Charge (nC)60
Maximum Drain Source Resistance (mOhm)0.67@10V
Maximum Gate Source Leakage Current (nA)100
Maximum Positive Gate Source Voltage (V)20
Maximum Pulsed Drain Current @ TC=25°C (A)1960
Typical Reverse Transfer Capacitance @ Vds (pF)580@15V
Maximum Continuous Drain Current on PCB @ TC=25°C (A)380
Description
Trans MOSFET N-CH 30V 380A 5-Pin(4+Tab) LFPAK T/R
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