Tab | Tab |
PPAP | No |
EU RoHS | Compliant with Exemption |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 5 |
Automotive | No |
PCB changed | 4 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single Triple Source |
Package Width | 4.7(Max) |
Package Height | 1.1(Max) |
Package Length | 5.3(Max) |
Product Category | Power MOSFET |
Supplier Package | LFPAK |
Maximum IDSS (uA) | 1 |
Process Technology | NextPowerS3 |
Standard Package Name | FPAK |
Typical Fall Time (ns) | 50 |
Typical Rise Time (ns) | 62 |
Number of Elements per Chip | 1 |
Maximum Gate Resistance (Ohm) | 3.9 |
Minimum Gate Resistance (Ohm) | 0.6 |
Maximum Power Dissipation (mW) | 333000 |
Typical Gate Charge @ 10V (nC) | 114 |
Typical Gate Charge @ Vgs (nC) | 55@4.5V|114@10V |
Maximum Gate Source Voltage (V) | 20 |
Typical Output Capacitance (pF) | 3621 |
Typical Turn-On Delay Time (ns) | 37 |
Maximum Drain Source Voltage (V) | 30 |
Typical Gate Plateau Voltage (V) | 2.5 |
Typical Turn-Off Delay Time (ns) | 65 |
Maximum Diode Forward Voltage (V) | 1 |
Typical Diode Forward Voltage (V) | 0.75 |
Typical Gate to Drain Charge (nC) | 19 |
Maximum Gate Threshold Voltage (V) | 2.2 |
Minimum Gate Threshold Voltage (V) | 1.2 |
Typical Gate Threshold Voltage (V) | 1.62 |
Typical Gate to Source Charge (nC) | 15 |
Typical Reverse Recovery Time (ns) | 50 |
Maximum Operating Temperature (°C) | 175 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 380 |
Operating Junction Temperature (°C) | -55 to 175 |
Typical Input Capacitance @ Vds (pF) | 6912@15V |
Typical Reverse Recovery Charge (nC) | 60 |
Maximum Drain Source Resistance (mOhm) | 0.67@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 1960 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 580@15V |
Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 380 |
Description | |