Product Attribute | Attribute Value |
Tab | Tab |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 5 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 4 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single Triple Source |
Package Width | 4.1(Max) |
Package Height | 1.1(Max) |
Package Length | 5(Max) |
Product Category | Power MOSFET |
Supplier Package | LFPAK |
Process Technology | TMOS |
Standard Package Name | FPAK |
Typical Fall Time (ns) | 310 |
Typical Rise Time (ns) | 16 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 110000 |
Typical Gate Charge @ 10V (nC) | 46 |
Typical Gate Charge @ Vgs (nC) | 46@10V |
Maximum Gate Source Voltage (V) | 20 |
Typical Turn-On Delay Time (ns) | 9 |
Maximum Drain Source Voltage (V) | 60 |
Typical Turn-Off Delay Time (ns) | 81 |
Maximum Operating Temperature (°C) | 175 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 30 |
Operating Junction Temperature (°C) | -55 to 175 |
Typical Input Capacitance @ Vds (pF) | 2590@30V |
Maximum Drain Source Resistance (mOhm) | 33@10V |
Description |