Product Attribute | Attribute Value |
Tab | Tab |
PPAP | Unknown |
EU RoHS | Compliant |
Material | SiC |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | Yes |
PCB changed | 7 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single Hex Source |
Package Width | 8.9(Max) |
Package Height | 4.8(Max) |
Package Length | 10.4(Max) |
Product Category | Power MOSFET |
Supplier Package | H2PAK |
Typical Fall Time (ns) | 9.9 |
Typical Rise Time (ns) | 26.6 |
Supplier Temperature Grade | Automotive |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 223000 |
Typical Gate Charge @ Vgs (nC) | 37@18V |
Maximum Gate Source Voltage (V) | 22 |
Typical Turn-On Delay Time (ns) | 18.7 |
Maximum Drain Source Voltage (V) | 1200 |
Typical Turn-Off Delay Time (ns) | 17.6 |
Maximum Operating Temperature (°C) | 175 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 30 |
Operating Junction Temperature (°C) | -55 to 175 |
Typical Input Capacitance @ Vds (pF) | 900@850V |
Maximum Drain Source Resistance (mOhm) | 87@18V |
Description |