Product Attribute | Attribute Value |
HTS | 8541.29.00.95 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | No Lead |
PCB changed | 8 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single Hex Drain Dual Source |
Package Width | 1.9 |
Package Height | 0.8(Max) |
Package Length | 3 |
Product Category | Power MOSFET |
Supplier Package | PowerPAK ChipFET |
Maximum IDSS (uA) | 1 |
Process Technology | TMOS |
Standard Package Name | Chip FET |
Typical Fall Time (ns) | 35|25 |
Typical Rise Time (ns) | 30|5 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 3100 |
Typical Gate Charge @ Vgs (nC) | 70@8V|43@4.5V |
Maximum Gate Source Voltage (V) | ±8 |
Typical Turn-On Delay Time (ns) | 12|30 |
Maximum Drain Source Voltage (V) | 12 |
Typical Turn-Off Delay Time (ns) | 70|80 |
Maximum Gate Threshold Voltage (V) | 0.9 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -50 |
Maximum Continuous Drain Current (A) | 25 |
Typical Input Capacitance @ Vds (pF) | 4100@6V |
Maximum Drain Source Resistance (mOhm) | 8.2@4.5V |
Maximum Gate Source Leakage Current (nA) | 2000 |
Description |