Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | No Lead |
PCB changed | 8 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single Hex Drain |
Package Width | 1.9 |
Package Height | 0.8(Max) |
Package Length | 3 |
Product Category | Power MOSFET |
Supplier Package | PowerPAK ChipFET |
Maximum IDSS (uA) | 1 |
Process Technology | TrenchFET |
Standard Package Name | Chip FET |
Typical Fall Time (ns) | 13 |
Typical Rise Time (ns) | 50 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 3500 |
Typical Gate Charge @ 10V (nC) | 17 |
Typical Gate Charge @ Vgs (nC) | 17@10V|8@4.5V |
Maximum Gate Source Voltage (V) | ±12 |
Typical Output Capacitance (pF) | 140 |
Typical Turn-On Delay Time (ns) | 21 |
Maximum Drain Source Voltage (V) | 20 |
Typical Turn-Off Delay Time (ns) | 29 |
Typical Gate to Drain Charge (nC) | 3 |
Maximum Gate Threshold Voltage (V) | 1.4 |
Typical Gate to Source Charge (nC) | 2 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -50 |
Maximum Continuous Drain Current (A) | 6.7 |
Typical Input Capacitance @ Vds (pF) | 665@10V |
Typical Reverse Recovery Charge (nC) | 17 |
Maximum Drain Source Resistance (mOhm) | 52@4.5V |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |