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MOSFETs SI7998DP-T1-GE3
Vishay
SI7998DP-T1-GE3
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
| Product Attribute | Attribute Value |
| HTS | 8541.29.00.95 |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 8 |
| Automotive | No |
| Lead Shape | No Lead |
| PCB changed | 8 |
| Part Status | Active |
| Channel Mode | Enhancement |
| Channel Type | N |
| Configuration | Dual Dual Drain |
| Package Width | 5.89 |
| Package Height | 1.07(Max) |
| Package Length | 4.9 |
| Product Category | Power MOSFET |
| Supplier Package | PowerPAK SO |
| Maximum IDSS (uA) | 1 |
| Process Technology | TrenchFET |
| Standard Package Name | SOP |
| Typical Fall Time (ns) | 10@Channel 1|13@Channel 2 |
| Typical Rise Time (ns) | 15@Channel 1|17@Channel 2 |
| Number of Elements per Chip | 2 |
| Maximum Gate Resistance (Ohm) | 7 |
| Maximum Power Dissipation (mW) | 3600@Channel 1|4000@Channel 2 |
| Typical Gate Charge @ 10V (nC) | 17@Channel 1|32@Channel 2 |
| Typical Gate Charge @ Vgs (nC) | 17@10V|8.2@4.5V@Channel 1|32@10V|15.3@4.5V@Channel 2 |
| Maximum Gate Source Voltage (V) | ±20 |
| Typical Output Capacitance (pF) | 200@Channel 1|390@Channel 2 |
| Typical Turn-On Delay Time (ns) | 20@Channel 1|26@Channel 2 |
| Maximum Drain Source Voltage (V) | 30 |
| Typical Gate Plateau Voltage (V) | 3@Channel 1|3.2@Channel 2 |
| Typical Turn-Off Delay Time (ns) | 22@Channel 1|35@Channel 2 |
| Maximum Diode Forward Voltage (V) | 1.2 |
| Typical Diode Forward Voltage (V) | 0.8 |
| Typical Gate to Drain Charge (nC) | 2.7@Channel 1|4.7@Channel 2 |
| Maximum Gate Threshold Voltage (V) | 2.5 |
| Minimum Gate Threshold Voltage (V) | 1.2 |
| Typical Gate to Source Charge (nC) | 3.2@Channel 1|6.3@Channel 2 |
| Typical Reverse Recovery Time (ns) | 20@Channel 1|27@Channel 2 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Continuous Drain Current (A) | 15@Channel 1|21@Channel 2 |
| Operating Junction Temperature (°C) | -55 to 150 |
| Typical Input Capacitance @ Vds (pF) | 1100@15V@Channel 1|2000@15V@Channel 2 |
| Typical Reverse Recovery Charge (nC) | 15@Channel 1|22@Channel 2 |
| Maximum Drain Source Resistance (mOhm) | 9.3@10V@Channel 1|5.3@10V@Channel 2 |
| Maximum Gate Source Leakage Current (nA) | 100 |
| Maximum Positive Gate Source Voltage (V) | 20 |
| Maximum Pulsed Drain Current @ TC=25°C (A) | 60@Channel 1|80@Channel 2 |
| Maximum Power Dissipation on PCB @ TC=25°C (W) | 3600@Channel 1|4000@Channel 2 |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 90@15V@Channel 1|160@15v@Channel 2 |
| Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 15@Channel 1|21@Channel 2 |
| Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 35@Channel 1|31@Channel 2 |
| Description |
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