Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 4 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 4 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single Dual Drain |
Package Width | 1.6(Max) |
Package Height | 0.31(Max) |
Package Length | 1.6(Max) |
Product Category | Power MOSFET |
Supplier Package | Micro Foot |
Maximum IDSS (uA) | 1 |
Process Technology | TrenchFET |
Standard Package Name | BGA |
Typical Fall Time (ns) | 100 |
Typical Rise Time (ns) | 25|10 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 2700 |
Typical Gate Charge @ 10V (nC) | 73 |
Typical Gate Charge @ Vgs (nC) | 73@10V|36@4.5V |
Maximum Gate Source Voltage (V) | ±10 |
Typical Turn-On Delay Time (ns) | 25|7 |
Maximum Drain Source Voltage (V) | 20 |
Typical Turn-Off Delay Time (ns) | 300|430 |
Maximum Gate Threshold Voltage (V) | 0.9 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 9.3 |
Typical Input Capacitance @ Vds (pF) | 2800@10V |
Maximum Drain Source Resistance (MOhm) | 23@4.5V |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |