Product Attribute | Attribute Value |
HTS | 8541.21.00.95 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 4 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 4 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single |
Package Width | 0.96 |
Package Height | 0.26 |
Package Length | 0.96 |
Product Category | Power MOSFET |
Supplier Package | Micro Foot |
Process Technology | TrenchFET |
Standard Package Name | BGA |
Typical Fall Time (ns) | 12|10 |
Typical Rise Time (ns) | 25|12 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 780 |
Typical Gate Charge @ Vgs (nC) | 9.5@4.5V|16@8V |
Maximum Gate Source Voltage (V) | ±8 |
Typical Turn-On Delay Time (ns) | 15|7 |
Maximum Drain Source Voltage (V) | 20 |
Typical Turn-Off Delay Time (ns) | 32|35 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 2.5 |
Typical Input Capacitance @ Vds (pF) | 610@10V |
Maximum Drain Source Resistance (MOhm) | 100@4.5V |
Description |