HTS | 8541.29.00.95 |
Tab | Tab |
PPAP | Unknown |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 5 |
Automotive | Yes |
Lead Shape | No Lead |
PCB changed | 4 |
Part Status | Unconfirmed |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Dual |
Package Width | 6.22 |
Package Height | 1.8 |
Package Length | 7.9 |
Product Category | Power MOSFET |
Supplier Package | PowerPAK |
Maximum IDSS (uA) | 1 |
Process Technology | TrenchFET |
Standard Package Name | PowerPAK |
Typical Fall Time (ns) | 7 |
Typical Rise Time (ns) | 4 |
Supplier Temperature Grade | Automotive |
Number of Elements per Chip | 2 |
Maximum Gate Resistance (Ohm) | 3 |
Minimum Gate Resistance (Ohm) | 1.1 |
Maximum Power Dissipation (mW) | 187000 |
Typical Gate Charge @ 10V (nC) | 46 |
Typical Gate Charge @ Vgs (nC) | 46@10V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Output Capacitance (pF) | 799 |
Typical Turn-On Delay Time (ns) | 11 |
Maximum Drain Source Voltage (V) | 100 |
Typical Gate Plateau Voltage (V) | 2.8 |
Typical Turn-Off Delay Time (ns) | 33 |
Maximum Diode Forward Voltage (V) | 1.2 |
Typical Diode Forward Voltage (V) | 1 |
Typical Gate to Drain Charge (nC) | 10 |
Maximum Gate Threshold Voltage (V) | 2.5 |
Minimum Gate Threshold Voltage (V) | 1.5 |
Typical Gate Threshold Voltage (V) | 2 |
Typical Gate to Source Charge (nC) | 7 |
Maximum Operating Temperature (°C) | 175 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 70 |
Operating Junction Temperature (°C) | -55 to 175 |
Typical Input Capacitance @ Vds (pF) | 2266@50V |
Maximum Drain Source Resistance (mOhm) | 8.6@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 280 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 34@50V |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 85 |
Description | |