HTS | 8541.29.00.95 |
Tab | Tab |
PPAP | No |
SVHC | Yes |
EU RoHS | Compliant with Exemption |
Mounting | Through Hole |
ECCN (US) | EAR99 |
Packaging | Tube |
Pin Count | 3 |
Automotive | No |
Lead Shape | Through Hole |
PCB changed | 3 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single |
Package Width | 4.6(Max) |
Package Height | 9.15(Max) |
Package Length | 10.4(Max) |
Product Category | Power MOSFET |
Supplier Package | TO-220AB |
Maximum IDSS (uA) | 1 |
Process Technology | MDmesh M2 |
Standard Package Name | TO-220 |
SVHC Exceeds Threshold | Yes |
Typical Fall Time (ns) | 9 |
Typical Rise Time (ns) | 11.5 |
Supplier Temperature Grade | Industrial |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 190000 |
Typical Gate Charge @ 10V (nC) | 41.5 |
Typical Gate Charge @ Vgs (nC) | 41.5@10V |
Maximum Gate Source Voltage (V) | ±25 |
Typical Output Capacitance (pF) | 75 |
Typical Turn-On Delay Time (ns) | 13.5 |
Maximum Drain Source Voltage (V) | 650 |
Typical Gate Plateau Voltage (V) | 4.9 |
Typical Turn-Off Delay Time (ns) | 72.5 |
Maximum Diode Forward Voltage (V) | 1.6 |
Typical Gate to Drain Charge (nC) | 18 |
Maximum Gate Threshold Voltage (V) | 4 |
Minimum Gate Threshold Voltage (V) | 2 |
Typical Gate Threshold Voltage (V) | 3 |
Typical Gate to Source Charge (nC) | 6.8 |
Typical Reverse Recovery Time (ns) | 544 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 24 |
Operating Junction Temperature (°C) | 150 |
Typical Input Capacitance @ Vds (pF) | 1790@100V |
Typical Reverse Recovery Charge (nC) | 10000 |
Maximum Drain Source Resistance (MOhm) | 140@10V |
Maximum Gate Source Leakage Current (nA) | 10000 |
Maximum Positive Gate Source Voltage (V) | 25 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 96 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 2@100V |
Description | |