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MOSFETs STS8DNH3LL
STMicroelectronics
STS8DNH3LL
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 8 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 8 |
| Part Status | Obsolete |
| Channel Mode | Enhancement |
| Channel Type | N |
| Configuration | Dual Dual Drain |
| Package Width | 4(Max) |
| Package Height | 1.65(Max) |
| Package Length | 5(Max) |
| Product Category | Power MOSFET |
| Supplier Package | SO N |
| Maximum IDSS (uA) | 1 |
| Process Technology | StripFET III |
| Standard Package Name | SOP |
| Typical Fall Time (ns) | 8 |
| Typical Rise Time (ns) | 14.5 |
| Number of Elements per Chip | 2 |
| Maximum Power Dissipation (mW) | 2000 |
| Typical Gate Charge @ Vgs (nC) | 7@4.5V |
| Maximum Gate Source Voltage (V) | ±16 |
| Typical Output Capacitance (pF) | 147 |
| Typical Turn-On Delay Time (ns) | 12 |
| Maximum Drain Source Voltage (V) | 30 |
| Typical Gate Plateau Voltage (V) | 3 |
| Typical Turn-Off Delay Time (ns) | 23 |
| Maximum Diode Forward Voltage (V) | 1.5 |
| Typical Gate to Drain Charge (nC) | 2.3 |
| Minimum Gate Threshold Voltage (V) | 1 |
| Typical Gate to Source Charge (nC) | 2.5 |
| Typical Reverse Recovery Time (ns) | 15 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Continuous Drain Current (A) | 8 |
| Operating Junction Temperature (°C) | 150 |
| Typical Input Capacitance @ Vds (pF) | 857@25V |
| Typical Reverse Recovery Charge (nC) | 5.7 |
| Maximum Drain Source Resistance (mOhm) | 22@10V |
| Maximum Gate Source Leakage Current (nA) | 10000 |
| Maximum Positive Gate Source Voltage (V) | 16 |
| Maximum Pulsed Drain Current @ TC=25°C (A) | 32 |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 20@25V |
| Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 62.5 |
| Description |
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