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SUG80050E-GE3
SUG80050E-GE3
MOSFETs SUG80050E-GE3
Vishay
SUG80050E-GE3
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
Product AttributeAttribute Value
HTS8541.29.00.95
TabTab
PPAPNo
EU RoHSCompliant
MountingThrough Hole
ECCN (US)EAR99
Pin Count3
AutomotiveNo
Lead ShapeThrough Hole
PCB changed3
Part StatusActive
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle
Package Width5.31(Max)
Package Height20.82(Max)
Package Length15.87(Max)
Product CategoryPower MOSFET
Supplier PackageTO-247
Maximum IDSS (uA)1
Process TechnologyThunderFET
Standard Package NameTO-247
Typical Fall Time (ns)55
Typical Rise Time (ns)44
Number of Elements per Chip1
Maximum Gate Resistance (Ohm)6.2
Minimum Gate Resistance (Ohm)0.6
Maximum Power Dissipation (mW)500000
Typical Gate Charge @ 10V (nC)110
Typical Gate Charge @ Vgs (nC)110@10V
Maximum Gate Source Voltage (V)±20
Typical Output Capacitance (pF)1100
Typical Turn-On Delay Time (ns)18
Maximum Drain Source Voltage (V)150
Typical Gate Plateau Voltage (V)4.6
Typical Turn-Off Delay Time (ns)72
Maximum Diode Forward Voltage (V)1.5
Typical Diode Forward Voltage (V)0.85
Typical Gate to Drain Charge (nC)28
Maximum Gate Threshold Voltage (V)4
Minimum Gate Threshold Voltage (V)2
Typical Gate to Source Charge (nC)33
Typical Reverse Recovery Time (ns)130
Maximum Operating Temperature (°C)175
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)100
Operating Junction Temperature (°C)-55 to 175
Typical Input Capacitance @ Vds (pF)6250@75V
Typical Reverse Recovery Charge (nC)710
Maximum Drain Source Resistance (MOhm)5.4@10V
Maximum Gate Source Leakage Current (nA)250
Maximum Positive Gate Source Voltage (V)20
Maximum Pulsed Drain Current @ TC=25°C (A)300
Typical Reverse Transfer Capacitance @ Vds (pF)65@75V
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)40
Description
Trans MOSFET N-CH 150V 100A 3-Pin(3+Tab) TO-247
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