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M378B1G73QH0-CK0
M378B1G73QH0-CK0
Memory Modules M378B1G73QH0-CK0
Samsung Electronics
M378B1G73QH0-CK0
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PLLNo
PPAPNo
ModuleDRAM Module
EU RoHSCompliant
MountingSocket
ECCN (US)4A994.a
Pin Count240
AutomotiveNo
Lead ShapeNo Lead
CAS Latency11
ECC SupportNo
Module Type240UDIMM
PCB changed240
Part StatusObsolete
SubcategoryDDR3 SDRAM
Module SidesDouble
Organization1Gx64
Self RefreshYes
Package Width4(Max)
Module Density8Gbyte
Package Height30
Package Length133.35
Number of RanksDual
Supplier PackageUDIMM
Chip Package TypeFBGA
Chip Configuration512Mx8
Chip Density (bit)4G
SPD EEPROM SupportYes
Data Bus Width (bit)64
Number of Chip Banks8
Max. Access Time (ns)0.225
Operating Current (mA)1040
Maximum Clock Rate (MHz)1600
Number of Chip per Module16
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.575
Minimum Operating Supply Voltage (V)1.425
Typical Operating Supply Voltage (V)1.5
Description
DRAM Module DDR3 SDRAM 8Gbyte 240UDIMM
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