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Memory Modules M378B1G73QH0-CK000
Samsung Electronics
M378B1G73QH0-CK000
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Memory
Memory Modules
Specification
| Product Attribute | Attribute Value |
| HTS | 8542.32.00.24 |
| PLL | No |
| Module | DRAM Module |
| CAS Latency | 11 |
| ECC Support | No |
| Module Type | 240UDIMM |
| Part Status | Obsolete |
| Subcategory | DDR3 SDRAM |
| Module Sides | Double |
| Organization | 1Gx64 |
| Self Refresh | Yes |
| Module Density | 8Gbyte |
| Number of Ranks | Dual |
| Chip Package Type | FBGA |
| Chip Configuration | 512Mx8 |
| Chip Density (bit) | 4G |
| SPD EEPROM Support | Yes |
| Data Bus Width (bit) | 64 |
| Number of Chip Banks | 8 |
| Max. Access Time (ns) | 0.225 |
| Operating Current (mA) | 1040 |
| Maximum Clock Rate (MHz) | 1600 |
| Number of Chip per Module | 16 |
| Maximum Operating Temperature (°C) | 95 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Supply Voltage (V) | 1.575 |
| Minimum Operating Supply Voltage (V) | 1.425 |
| Typical Operating Supply Voltage (V) | 1.5 |
| Description |
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