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M378B5273DH0-CK0
M378B5273DH0-CK0
Memory Modules M378B5273DH0-CK0
Samsung Electronics
M378B5273DH0-CK0
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PLLNo
PPAPNo
ModuleDRAM Module
EU RoHSCompliant
MountingSocket
ECCN (US)4A994.a
Pin Count240
AutomotiveNo
Lead ShapeNo Lead
CAS Latency11
ECC SupportNo
Module Type240UDIMM
PCB changed240
Part StatusActive
SubcategoryDDR3L SDRAM
Module SidesDouble
Organization512Mx64
Self RefreshYes
Package Width4(Max)
Module Density4Gbyte
Package Height30
Package Length133.35
Number of RanksDual
Supplier PackageUDIMM
Chip Package TypeFBGA
Chip Configuration256Mx8
Chip Density (bit)2G
SPD EEPROM SupportYes
Data Bus Width (bit)64
Number of Chip Banks8
Max. Access Time (ns)0.225
Operating Current (mA)920
Maximum Clock Rate (MHz)1600
Number of Chip per Module16
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.575
Minimum Operating Supply Voltage (V)1.425
Typical Operating Supply Voltage (V)1.5
Description
DRAM Module DDR3L SDRAM 4Gbyte 240UDIMM
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