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Memory Modules M378B5773CH0-CH900
Samsung Electronics
M378B5773CH0-CH900
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PLLNo
PPAPNo
ModuleDRAM Module
EU RoHSCompliant
MountingSocket
ECCN (US)4A994.a
Pin Count240
AutomotiveNo
Lead ShapeNo Lead
CAS Latency9
ECC SupportNo
Module Type240UDIMM
PCB changed240
Part StatusObsolete
SubcategoryDDR3 SDRAM
Module SidesSingle
Organization256Mx64
Self RefreshYes
Package Width4(Max)
Module Density2Gbyte
Package Height30
Package Length133.35
Number of RanksSingle
Supplier PackageUDIMM
Chip Package TypeFBGA
Chip Configuration256Mx8
Chip Density (bit)2G
SPD EEPROM SupportYes
Data Bus Width (bit)64
Number of Chip Banks8
Max. Access Time (ns)0.255
Operating Current (mA)1120
Maximum Clock Rate (MHz)1333
Number of Chip per Module8
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.575
Minimum Operating Supply Voltage (V)1.425
Typical Operating Supply Voltage (V)1.5
Description
DRAM Module DDR3 SDRAM 2Gbyte 240UDIMM
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