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M386B4G70DM0-CMA30
M386B4G70DM0-CMA30
Memory Modules M386B4G70DM0-CMA30
Samsung Electronics
M386B4G70DM0-CMA30
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
HTS8473.30.11.40
ModuleDRAM Module
ECCN (US)4A994.a
CAS Latency13
ECC SupportNo
Module Type240LRDIMM
Part StatusObsolete
SubcategoryDDR3 SDRAM
Module SidesDouble
Organization4Gx72
Module Density32Gbyte
Number of RanksQuad
Chip Package Type78FBGA
Chip Configuration2Gx4
Chip Density (bit)8G
Data Bus Width (bit)72
Maximum Clock Rate (MHz)1866
Number of Chip per Module36
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)0
Typical Operating Supply Voltage (V)1.5
Description
DRAM Module DDR3 SDRAM 32Gbyte 240LRDIMM
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