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Memory Modules M393B2G70DB0-YH9
Samsung Electronics
M393B2G70DB0-YH9
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Memory
Memory Modules
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| Module | DRAM Module |
| EU RoHS | Compliant |
| Mounting | Socket |
| ECCN (US) | 4A994.a |
| Pin Count | 240 |
| Automotive | No |
| Lead Shape | No Lead |
| CAS Latency | 9 |
| ECC Support | No |
| Module Type | 240RDIMM |
| PCB changed | 240 |
| Part Status | Obsolete |
| Subcategory | DDR3 SDRAM |
| Module Sides | Double |
| Organization | 2Gx72 |
| Package Width | 4(Max) |
| Module Density | 16Gbyte |
| Package Height | 30 |
| Package Length | 133.35 |
| Number of Ranks | Dual |
| Supplier Package | RDIMM |
| Chip Package Type | FBGA |
| Chip Configuration | 1Gx4 |
| Chip Density (bit) | 4G |
| Data Bus Width (bit) | 72 |
| Maximum Clock Rate (MHz) | 1333 |
| Number of Chip per Module | 36 |
| Supplier Temperature Grade | Commercial |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | 0 |
| Typical Operating Supply Voltage (V) | 1.35 |
| Description |
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