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M393B5273DH0-CH9
M393B5273DH0-CH9
Memory Modules M393B5273DH0-CH9
Samsung Electronics
M393B5273DH0-CH9
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PLLNo
PPAPNo
ModuleDRAM Module
EU RoHSCompliant
MountingSocket
ECCN (US)4A994.a
Pin Count240
AutomotiveNo
Lead ShapeNo Lead
CAS Latency9
ECC SupportYes
Module Type240DIMM
PCB changed240
Part StatusObsolete
SubcategoryDDR3 SDRAM
Module SidesDouble
Organization512Mx72
Self RefreshYes
Package Width4(Max)
Module Density4Gbyte
Package Height30
Package Length133.35
Number of RanksDual
Supplier PackageRDIMM
Chip Package TypeFBGA
Chip Configuration256Mx8
Chip Density (bit)2G
SPD EEPROM SupportYes
Data Bus Width (bit)72
Number of Chip Banks8
Max. Access Time (ns)0.255
Operating Current (mA)1580
Maximum Clock Rate (MHz)1333
Number of Chip per Module18
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.575
Minimum Operating Supply Voltage (V)1.425
Typical Operating Supply Voltage (V)1.5
Description
DRAM Module DDR3 SDRAM 4Gbyte 240DIMM
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