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Memory Modules M471A1G43DB0-CPB
Samsung Electronics
M471A1G43DB0-CPB
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Memory
Memory Modules
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| Module | DRAM Module |
| EU RoHS | Compliant |
| Mounting | Socket |
| ECCN (US) | EAR99 |
| Pin Count | 260 |
| Automotive | No |
| CAS Latency | 15 |
| ECC Support | No |
| Module Type | 260USODIMM |
| PCB changed | 260 |
| Part Status | Obsolete |
| Subcategory | DDR4 SDRAM |
| Organization | 1Gx64 |
| Package Width | 3.7(Max) |
| Module Density | 8Gbyte |
| Package Height | 30 |
| Package Length | 69.6 |
| Number of Ranks | Dual |
| Supplier Package | USODIMM |
| Chip Package Type | 78FBGA |
| Chip Configuration | 512Mx8 |
| Chip Density (bit) | 4G |
| Data Bus Width (bit) | 64 |
| Operating Current (mA) | 890 |
| Maximum Clock Rate (MHz) | 2133 |
| Number of Chip per Module | 16 |
| Maximum Operating Supply Voltage (V) | 1.26 |
| Minimum Operating Supply Voltage (V) | 1.14 |
| Typical Operating Supply Voltage (V) | 1.2 |
| Description |
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