Product Attribute | Attribute Value |
HTS | 8473.30.11.40 |
PLL | No |
PPAP | No |
Module | DRAM Module |
EU RoHS | Compliant |
Mounting | Surface Mount |
Pin Count | 78 |
Automotive | No |
CAS Latency | 19 |
ECC Support | No |
Module Type | 260SODIMM |
PCB changed | 78 |
Part Status | Active |
Subcategory | DDR4 SDRAM |
Module Sides | Double |
Organization | 1Gx64 |
Self Refresh | Yes |
Package Width | 10.3 |
Module Density | 8Gbyte |
Package Height | 0.73 |
Package Length | 11 |
Number of Ranks | Single |
Supplier Package | FBGA |
Chip Package Type | 78FBGA |
Chip Configuration | 1Gx8 |
Chip Density (bit) | 8G |
SPD EEPROM Support | No |
Data Bus Width (bit) | 64 |
Number of Chip Banks | 16 |
Max. Access Time (ns) | 0.17 |
Maximum Clock Rate (MHz) | 2666 |
Number of Chip per Module | 8 |
Supplier Temperature Grade | Commercial |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Supply Voltage (V) | 1.26 |
Minimum Operating Supply Voltage (V) | 1.14 |
Typical Operating Supply Voltage (V) | 1.2 |
Description |