Product Attribute | Attribute Value |
HTS | 8473.30.11.40 |
PPAP | No |
Module | DRAM Module |
EU RoHS | Compliant |
Mounting | Socket |
ECCN (US) | 4A994.a |
Pin Count | 260 |
Automotive | No |
Lead Shape | No Lead |
CAS Latency | 17 |
ECC Support | No |
Module Type | 260SODIMM |
PCB changed | 260 |
Part Status | Active |
Subcategory | DDR4 SDRAM |
Organization | 512Mx64 |
Package Width | 3.7(Max) |
Module Density | 4Gbyte |
Package Height | 30 |
Package Length | 69.6 |
Number of Ranks | Single |
Supplier Package | SODIMM |
Chip Package Type | FBGA |
Chip Configuration | 512Mx16 |
Chip Density (bit) | 8G |
Data Bus Width (bit) | 64 |
Maximum Clock Rate (MHz) | 2400 |
Number of Chip per Module | 8 |
Supplier Temperature Grade | Commercial |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | 0 |
Typical Operating Supply Voltage (V) | 1.2 |
Description |