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M471B5673EH1-CH9
M471B5673EH1-CH9
Memory Modules M471B5673EH1-CH9
Samsung Electronics
M471B5673EH1-CH9
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PLLNo
PPAPNo
ModuleDRAM Module
EU RoHSCompliant
MountingSocket
ECCN (US)4A994.a
Pin Count204
AutomotiveNo
Lead ShapeNo Lead
CAS Latency9
ECC SupportNo
Module Type204USODIMM
PCB changed204
Part StatusObsolete
SubcategoryDDR3 SDRAM
Module SidesDouble
Organization256Mx64
Self RefreshYes
Package Width3.8(Max)
Module Density2Gbyte
Package Height30
Package Length67.6
Number of RanksDual
Supplier PackageUSODIMM
Chip Package TypeFBGA
Chip Configuration128Mx8
Chip Density (bit)1G
SPD EEPROM SupportYes
Data Bus Width (bit)64
Number of Chip Banks8
Max. Access Time (ns)20
Operating Current (mA)1360
Maximum Clock Rate (MHz)1333
Number of Chip per Module16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.575
Minimum Operating Supply Voltage (V)1.425
Typical Operating Supply Voltage (V)1.5
Description
DRAM Module DDR3 SDRAM 2Gbyte 204USODIMM
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