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MT16HTF12864HY-667F1
MT16HTF12864HY-667F1
Memory Modules MT16HTF12864HY-667F1
Micron Technology
MT16HTF12864HY-667F1
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PPAPNo
ModuleDRAM Module
EU RoHSCompliant
MountingSocket
ECCN (US)EAR99
PackagingTray
Pin Count200
AutomotiveNo
Lead ShapeNo Lead
CAS Latency5
ECC SupportNo
Module Type200SODIMM
PCB changed200
Part StatusObsolete
SubcategoryDDR2 SDRAM
Organization128Mx64
Package Width3.8(Max)
Module Density1Gbyte
Package Height30.15(Max)
Package Length67.75(Max)
Number of RanksDual
Supplier PackageSODIMM
Chip Configuration64Mx8
Chip Density (bit)512M
Data Bus Width (bit)64
Max. Access Time (ns)0.045
Standard Package NameDIM
Operating Current (mA)1496
Maximum Clock Rate (MHz)667
Number of Chip per Module16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Module DDR2 SDRAM 1Gbyte 200SODIMM Tray
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