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MT16HTF25664HY-53EE1
MT16HTF25664HY-53EE1
Memory Modules MT16HTF25664HY-53EE1
Micron Technology
MT16HTF25664HY-53EE1
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PPAPNo
ModuleDRAM Module
EU RoHSCompliant
MountingSocket
ECCN (US)EAR99
PackagingTray
Pin Count200
AutomotiveNo
Lead ShapeNo Lead
CAS Latency4
ECC SupportNo
Module Type200SODIMM
PCB changed200
Part StatusObsolete
SubcategoryDDR2 SDRAM
Organization256Mx64
Package Width3.8(Max)
Module Density2Gbyte
Package Height30.15(Max)
Package Length67.75(Max)
Number of RanksDual
Supplier PackageSODIMM
Chip Configuration128Mx8
Chip Density (bit)1G
Data Bus Width (bit)64
Max. Access Time (ns)0.05
Standard Package NameDIM
Operating Current (mA)1056
Maximum Clock Rate (MHz)533
Number of Chip per Module16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Module DDR2 SDRAM 2Gbyte 200SODIMM Tray
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