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MT16LSDT3264AY-13EG3
MT16LSDT3264AY-13EG3
Memory Modules MT16LSDT3264AY-13EG3
Micron Technology
MT16LSDT3264AY-13EG3
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PPAPNo
ModuleDRAM Module
EU RoHSCompliant with Exemption
MountingSocket
ECCN (US)EAR99
PackagingTray
Pin Count168
AutomotiveNo
Lead ShapeNo Lead
CAS Latency2
ECC SupportNo
Module Type168UDIMM
PCB changed168
Part StatusObsolete
SubcategorySDRAM
Organization32Mx64
Package Width3.99(Max)
Module Density256Mbyte
Package Height35.05(Max)
Package Length133.5(Max)
Number of RanksDual
Supplier PackageDIMM
Chip Configuration16Mx8
Chip Density (bit)128M
Data Bus Width (bit)64
Max. Access Time (ns)5.4
Standard Package NameDIM
Operating Current (mA)1336
Maximum Clock Rate (MHz)133
Number of Chip per Module16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)65
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3
Typical Operating Supply Voltage (V)3.3
Description
DRAM Module SDRAM 256Mbyte 168UDIMM Tray
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