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MT16LSDT6464AG-133C2
MT16LSDT6464AG-133C2
Memory Modules MT16LSDT6464AG-133C2
Micron Technology
MT16LSDT6464AG-133C2
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PPAPNo
ModuleDRAM Module
EU RoHSNot Compliant
MountingSocket
ECCN (US)EAR99
PackagingTray
Pin Count168
AutomotiveNo
Lead ShapeNo Lead
CAS Latency3
ECC SupportNo
Module Type168UDIMM
PCB changed168
Part StatusUnconfirmed
SubcategorySDRAM
Organization64Mx64
Self RefreshYes
Package Width3.18(Max)
Module Density512Mbyte
Package Height28.73(Max)
Package Length133.5(Max)
Refresh Cycles8K
Number of RanksDual
Supplier PackageDIMM
Chip Configuration32Mx8
Chip Density (bit)256M
Data Bus Width (bit)64
Max. Access Time (ns)5.4|6
Standard Package NameDIM
Operating Current (mA)1096
Maximum Clock Rate (MHz)133
Number of Chip per Module16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3
Typical Operating Supply Voltage (V)3.3
Description
DRAM Module SDRAM 512Mbyte 168UDIMM Tray
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