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MT16VDDF6464HG-335C2
MT16VDDF6464HG-335C2
Memory Modules MT16VDDF6464HG-335C2
Micron Technology
MT16VDDF6464HG-335C2
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PPAPNo
ModuleDRAM Module
EU RoHSNot Compliant
MountingSocket
ECCN (US)EAR99
PackagingTray
Pin Count200
AutomotiveNo
Lead ShapeNo Lead
CAS Latency2.5
ECC SupportNo
Module Type200SODIMM
PCB changed200
Part StatusUnconfirmed
SubcategoryDDR SDRAM
Organization64Mx64
Package Width3.8(Max)
Module Density512Mbyte
Package Height31.9(Max)
Package Length67.75(Max)
Number of RanksDual
Supplier PackageSODIMM
Chip Configuration32Mx8
Chip Density (bit)256M
Data Bus Width (bit)64
Standard Package NameDIM
Operating Current (mA)1432
Maximum Clock Rate (MHz)333
Number of Chip per Module16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)2.7
Minimum Operating Supply Voltage (V)2.3
Typical Operating Supply Voltage (V)2.5
Description
DRAM Module DDR SDRAM 512Mbyte 200SODIMM Tray
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