Product Attribute | Attribute Value |
PPAP | No |
Module | DRAM Module |
EU RoHS | Compliant with Exemption |
Mounting | Socket |
ECCN (US) | EAR99 |
Pin Count | 200 |
Automotive | No |
Lead Shape | No Lead |
CAS Latency | 2.5 |
ECC Support | No |
Module Type | 200SODIMM |
PCB changed | 200 |
Part Status | Obsolete |
Subcategory | DDR SDRAM |
Organization | 64Mx64 |
Package Width | 3.8(Max) |
Module Density | 512Mbyte |
Package Height | 31.9(Max) |
Package Length | 67.75(Max) |
Number of Ranks | Dual |
Supplier Package | SODIMM |
Chip Configuration | 32Mx8 |
Chip Density (bit) | 256M |
Data Bus Width (bit) | 64 |
Standard Package Name | DIM |
Operating Current (mA) | 1432 |
Maximum Clock Rate (MHz) | 333 |
Number of Chip per Module | 16 |
Supplier Temperature Grade | Commercial |
Maximum Operating Temperature (°C) | 70 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Supply Voltage (V) | 2.7 |
Minimum Operating Supply Voltage (V) | 2.3 |
Typical Operating Supply Voltage (V) | 2.5 |
Description |