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MT8HTF3264AY-53EB3
MT8HTF3264AY-53EB3
Memory Modules MT8HTF3264AY-53EB3
Micron Technology
MT8HTF3264AY-53EB3
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PPAPNo
ModuleDRAM Module
EU RoHSCompliant with Exemption
MountingSocket
ECCN (US)EAR99
PackagingTray
Pin Count240
AutomotiveNo
Lead ShapeNo Lead
CAS Latency4
ECC SupportNo
Module Type240UDIMM
PCB changed240
Part StatusObsolete
SubcategoryDDR2 SDRAM
Organization32Mx64
Package Width2.7(Max)
Module Density256Mbyte
Package Height30.5(Max)
Package Length133.5(Max)
Number of RanksSingle
Supplier PackageUDIMM
Chip Configuration32Mx8
Chip Density (bit)256M
Data Bus Width (bit)64
Standard Package NameDIM
Operating Current (mA)1280
Maximum Clock Rate (MHz)533
Number of Chip per Module8
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Module DDR2 SDRAM 256Mbyte 240UDIMM Tray
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