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MT8HTF6464HDY-53EB3
MT8HTF6464HDY-53EB3
Memory Modules MT8HTF6464HDY-53EB3
Micron Technology
MT8HTF6464HDY-53EB3
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
HTS8542.31.00.01
PPAPNo
ModuleDRAM Module
EU RoHSCompliant
MountingSocket
ECCN (US)EAR99
PackagingTray
Pin Count200
AutomotiveNo
Lead ShapeNo Lead
CAS Latency4
ECC SupportNo
Module Type200SODIMM
PCB changed200
Part StatusObsolete
SubcategoryDDR2 SDRAM
Organization64Mx64
Package Width3.8(Max)
Module Density512Mbyte
Package Height31.15(Max)
Package Length67.75(Max)
Number of RanksDual
Supplier PackageSODIMM
Chip Configuration32Mx16
Chip Density (bit)512M
Data Bus Width (bit)64
Standard Package NameDIM
Operating Current (mA)840
Maximum Clock Rate (MHz)533
Number of Chip per Module8
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Module DDR2 SDRAM 512Mbyte 200SODIMM Tray
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