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Memory Modules MT8LSDT1664HG-133G3
Micron Technology
MT8LSDT1664HG-133G3
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Memory
Memory Modules
Specification
| Product Attribute | Attribute Value |
| PLL | No |
| PPAP | No |
| Module | DRAM Module |
| EU RoHS | Not Compliant |
| PC Type | PC-133 |
| Mounting | Socket |
| ECCN (US) | EAR99 |
| Packaging | Tray |
| Pin Count | 144 |
| Automotive | No |
| Lead Shape | No Lead |
| CAS Latency | 3 |
| ECC Support | No |
| Module Type | 144SODIMM |
| PCB changed | 144 |
| Part Status | Obsolete |
| Subcategory | SDRAM |
| Module Sides | Double |
| Organization | 16Mx64 |
| Self Refresh | Yes |
| Package Width | 3.8(Max) |
| Module Density | 128Mbyte |
| Package Height | 31.88(Max) |
| Package Length | 67.72(Max) |
| Refresh Cycles | 4K |
| Number of Ranks | Dual |
| Supplier Package | USODIMM |
| Chip Configuration | 8Mx16 |
| Chip Density (bit) | 128M |
| SPD EEPROM Support | Yes |
| Data Bus Width (bit) | 64 |
| Number of Chip Banks | 4 |
| Max. Access Time (ns) | 5.4|6 |
| Standard Package Name | DIM |
| Operating Current (mA) | 608 |
| Maximum Clock Rate (MHz) | 133 |
| Number of Chip per Module | 8 |
| Supplier Temperature Grade | Commercial |
| Maximum Operating Temperature (°C) | 70 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 3 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Description |
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