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MT8LSDT3264HG-13ED2
MT8LSDT3264HG-13ED2
Memory Modules MT8LSDT3264HG-13ED2
Micron Technology
MT8LSDT3264HG-13ED2
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PPAPNo
ModuleDRAM Module
EU RoHSNot Compliant
MountingSocket
ECCN (US)EAR99
PackagingTray
Pin Count144
AutomotiveNo
Lead ShapeNo Lead
CAS Latency2
ECC SupportNo
Module Type144SODIMM
PCB changed144
Part StatusObsolete
SubcategorySDRAM
Organization32Mx64
Self RefreshYes
Package Width3.8(Max)
Module Density256Mbyte
Package Height31.88(Max)
Package Length67.72(Max)
Refresh Cycles8K
Number of RanksDual
Supplier PackageUSODIMM
Chip Configuration16Mx16
Chip Density (bit)256M
Data Bus Width (bit)64
Max. Access Time (ns)5.4
Standard Package NameDIM
Operating Current (mA)548
Maximum Clock Rate (MHz)133
Number of Chip per Module8
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3
Typical Operating Supply Voltage (V)3.3
Description
DRAM Module SDRAM 256Mbyte 144SODIMM Tray
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