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S71GL064NB0BHW0K0
S71GL064NB0BHW0K0
Multi-Chip Package Memory S71GL064NB0BHW0K0
Cypress
S71GL064NB0BHW0K0
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Memory
Multi-Chip Package Memory
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991.b.1.a
PackagingTray
Pin Count56
AutomotiveNo
Lead ShapeBall
PCB changed56
Part StatusObsolete
Organization4Mx16 Flash + 2Mx16 PSRAM
Package Width7
Package Height0.97(Max)
Package Length9
ProgrammabilityYes
Supplier PackageFBGA
Standard Package NameBGA
SRAM Memory Size (bit)32M
Flash Memory Size (bit)64M
Supplier Temperature GradeWireless
SRAM Maximum Access Time (ns)70
Flash Maximum Access Time (ns)90
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-25
Maximum Operating Supply Voltage (V)3.1
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3
Description
MCP 4Mx16 Flash + 2Mx16 PSRAM 3V 56-Pin FBGA Tray
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