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S71KL256SC0BHB000
S71KL256SC0BHB000
Multi-Chip Package Memory S71KL256SC0BHB000
Cypress
S71KL256SC0BHB000
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Memory
Multi-Chip Package Memory
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PPAPYes
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTray
Pin Count24
AutomotiveYes
Lead ShapeBall
PCB changed24
Part StatusActive
Organization32Mx8 Flash + 8Mx8 DDR DRAM
Package Width6
Package Height1(Max) - 0.2(Min)
Package Length8
ProgrammabilityYes
Supplier PackageFBGA
Process Technology65nm
Standard Package NameBGA
SRAM Memory Size (bit)64M
Flash Memory Size (bit)256M
Supplier Temperature GradeAutomotive
Maximum Operating Temperature (°C)105
Minimum Operating Temperature (°C)-40
Typical Operating Supply Voltage (V)3
Description
MCP 32Mx8 Flash + 8Mx8 DDR DRAM 3V Automotive 24-Pin FBGA Tray
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