Product Attribute | Attribute Value |
HTS | 8542.32.00.71 |
PPAP | Yes |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 24 |
Automotive | Yes |
Lead Shape | Ball |
PCB changed | 24 |
Part Status | Active |
Organization | 32Mx8 Flash + 8Mx8 DDR DRAM |
Package Width | 6 |
Package Height | 1(Max) - 0.2(Min) |
Package Length | 8 |
Programmability | Yes |
Supplier Package | FBGA |
Process Technology | 65nm |
Standard Package Name | BGA |
SRAM Memory Size (bit) | 64M |
Flash Memory Size (bit) | 256M |
Supplier Temperature Grade | Automotive |
Maximum Operating Temperature (°C) | 105 |
Minimum Operating Temperature (°C) | -40 |
Typical Operating Supply Voltage (V) | 3 |
Description |