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S71KS512SC0BHV000
S71KS512SC0BHV000
Multi-Chip Package Memory S71KS512SC0BHV000
Cypress
S71KS512SC0BHV000
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Memory
Multi-Chip Package Memory
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991.B.1.A
PackagingTray
Pin Count24
AutomotiveNo
Lead ShapeBall
PCB changed24
Part StatusActive
Organization64Mx8 Flash + 8Mx8 DDR DRAM
Package Width6
Package Height1(Max) - 0.2(Min)
Package Length8
ProgrammabilityYes
Supplier PackageFBGA
Process Technology65nm
Standard Package NameBGA
SRAM Memory Size (bit)64M
Flash Memory Size (bit)512M
Supplier Temperature GradeIndustrial Plus
Maximum Operating Temperature (°C)105
Minimum Operating Temperature (°C)-40
Typical Operating Supply Voltage (V)1.8
Description
MCP 64Mx8 Flash + 8Mx8 DDR DRAM 1.8V 24-Pin FBGA Tray
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