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Multi-Chip Package Memory S71WS256PC0HH3YL0
Cypress
S71WS256PC0HH3YL0
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Memory
Multi-Chip Package Memory
Specification
| Product Attribute | Attribute Value |
| HTS | 8542.32.00.71 |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | 3A991.B.1.A |
| Packaging | Tray |
| Pin Count | 84 |
| Automotive | No |
| Lead Shape | Ball |
| PCB changed | 84 |
| Part Status | Obsolete |
| Organization | 16Mx16 Flash + 4Mx16 PSRAM |
| Package Width | 8 |
| Package Height | 0.97(Max) |
| Package Length | 11.6 |
| Programmability | Yes |
| Supplier Package | FBGA |
| Standard Package Name | BGA |
| SRAM Memory Size (bit) | 64M |
| Flash Memory Size (bit) | 256M |
| Supplier Temperature Grade | Wireless |
| SRAM Maximum Access Time (ns) | 70 |
| Flash Maximum Access Time (ns) | 80 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -25 |
| Maximum Operating Supply Voltage (V) | 1.95 |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Description |
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